Company Filing History:
2 out of 131,611 
2 out of 592 Years Active: 2024-2025
Title: Seokkan Ki: Innovator in Composite Structures and Semiconductor Packages
Introduction
Seokkan Ki is an inventor based in Daejeon, South Korea. He has made significant contributions to the fields of composite structures and semiconductor technology. Although he currently holds no granted patents, his innovative ideas are reflected in his latest patent applications.
Latest Patent Applications
Seokkan Ki's recent patent applications include a composite structure and a semiconductor package with a heat dissipation member. The composite structure features a substrate that includes at least one void, filled by a phase-change layer. This layer is complemented by an interface layer made of a copper gallium (CuGa) compound, which is in direct contact with both the substrate and the phase-change layer. The semiconductor package application describes a circuit board housing a semiconductor chip, with a heat dissipation member positioned adjacent to it. A heat transmission member, consisting of a resin insulating body and phase change metal particles, connects the semiconductor chip to the heat dissipation member, facilitating efficient heat transfer.
Conclusion
Seokkan Ki's work showcases his innovative approach to solving challenges in composite materials and semiconductor technology. His latest patent applications highlight his potential to contribute significantly to these fields in the future.