Cambridge, MA, United States of America

Sen Dai


Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2021

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1 patent (USPTO):Explore Patents

Title: Sen Dai - Innovator in Shape Transformation Technologies

Introduction

Sen Dai is a prominent inventor based in Cambridge, MA (US). He has made significant contributions to the field of mechanical engineering, particularly in the area of modular structures and shape transformation technologies. His innovative work has the potential to revolutionize various applications in robotics and structural design.

Latest Patents

Sen Dai holds a patent for "Methods and apparatus for shape transformation of multi-linkage structure." This patent describes a modular structure that comprises multiple mechanical linkages capable of undergoing two-dimensional or three-dimensional shape transformations. These transformations include bending, twisting, shearing, uniform scaling, and anisotropic scaling. The actuation of these shape transformations is achieved by applying force to specific locations within the structure. Each linkage in the modular structure may consist of a four-bar linkage, and the exact transformation is determined by the type and location of these linkages.

Career Highlights

Sen Dai is affiliated with the Massachusetts Institute of Technology, where he continues to advance his research and development in innovative mechanical systems. His work has garnered attention for its practical applications and theoretical advancements in the field.

Collaborations

Sen Dai has collaborated with notable colleagues, including Jifei Ou and Zhao Ma. Their combined expertise contributes to the ongoing research and development of cutting-edge technologies in shape transformation.

Conclusion

Sen Dai's contributions to the field of mechanical engineering, particularly through his patent on shape transformation technologies, highlight his role as an influential inventor. His work at the Massachusetts Institute of Technology continues to inspire advancements in modular structures and their applications.

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