Seiichi Ohmori

Title: Seiichi Ohmori: Innovator in Thickness Measurement Technology

Introduction

Seiichi Ohmori is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of measurement technology, particularly with his innovative thickness measurement device. His work exemplifies the intersection of engineering and practical application in industrial settings.

Latest Patents

Ohmori holds a patent for a thickness measurement device and method. This device includes an ultrasonic transmitter that transmits ultrasonic waves to a measurement object. It also features an ultrasonic receiver that captures the reflected waves from the measurement object. The device is designed with a first extraction unit to extract the first reflected wave from the first surface of the measurement object. Additionally, a second extraction unit identifies multiple candidates for the second reflected wave from the second surface. A matching degree calculation unit computes the matching degree between the first reflected wave and each candidate. Finally, a candidate determination unit selects the candidate with the highest matching degree as the second reflected wave, and a thickness calculation unit determines the thickness of the measurement object.

Career Highlights

Seiichi Ohmori is associated with IHI Corporation, where he applies his expertise in measurement technology. His innovative approach has led to advancements in the accuracy and efficiency of thickness measurements in various applications.

Collaborations

Ohmori has collaborated with colleagues such as Masahiro Hato and Tomohiko Shiota. Their teamwork has contributed to the development of cutting-edge technologies in their field.

Conclusion

Seiichi Ohmori's contributions to thickness measurement technology highlight his role as an influential inventor. His patented device showcases the importance of innovation in enhancing measurement accuracy and efficiency.