Company Filing History:
Years Active: 2023
Title: Innovations by Inventor Sebin Choi
Introduction
Sebin Choi is a notable inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of three patents. His work primarily focuses on advancements in die bonding apparatuses and semiconductor packaging methods.
Latest Patents
Sebin Choi's latest patents include a method of manufacturing a semiconductor package, which features a bonding head for a die bonding apparatus. This bonding head consists of a head body and a thermal pressurizer mounted on its lower surface. The thermal pressurizer is designed to hold and heat at least one die, incorporating a heater with a first heating surface that faces the held surface of the die. Additionally, a thermal compensator is positioned at the outer region of the die, extending downwardly from the lower surface of the head body. This thermal compensator includes at least one thermal compensating block that emits heat from a heating source and faces the side surface of the die held on the thermal pressurizer.
Career Highlights
Sebin Choi is currently employed at Samsung Electronics Co., Ltd., where he continues to innovate in the semiconductor industry. His expertise and inventions have contributed to the advancement of technology in this critical field.
Collaborations
Sebin Choi has collaborated with notable coworkers, including Sunghyup Kim and Sukwon Lee. Their combined efforts have further enhanced the development of innovative solutions in semiconductor technology.
Conclusion
Sebin Choi's contributions to semiconductor technology through his patents and work at Samsung Electronics Co., Ltd. highlight his role as a key innovator in the industry. His inventions are paving the way for advancements in manufacturing processes and technology.