Taejeon-si, South Korea

Se Meyung Hwang


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 1998

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1 patent (USPTO):Explore Patents

Title: **Se Meyung Hwang: Innovator in Multi-Layer Printed Circuit Board Technology**

Introduction

Se Meyung Hwang is a notable inventor based in Taejeon-si, South Korea, recognized for his contributions to advanced printed circuit board technology. With a solid patent portfolio, he has made significant strides in enhancing the manufacturing processes used in modern electronics.

Latest Patents

Hwang holds a patent for a "Method for manufacturing build-up multi-layer printed circuit board." This innovative method addresses the complexity of producing multi-layer printed circuit boards, which are essential components in various electronic devices, including motherboards for computers, cameras, multi-chip modules (MCMs), chip size packages (CSPs), and portable phones. The patented method improves the inner-layer connecting state by sequentially stacking insulating resin layers and circuit conductor layers. The process involves creating via holes of varying sizes within the circuit board layers, culminating in a robust and effective build-up multi-layer printed circuit board.

Career Highlights

Se Meyung Hwang currently works with Samsung Electro-Mechanics Co., Ltd., a leading company in the electronics field. His role at the company underscores his expertise in printed circuit board technology and its applications in modern electronics. Throughout his career, Hwang has focused on innovation and quality in the production of complex electronic components.

Collaborations

Hwang has collaborated with talented individuals such as Keon Yang Park and Young Hwan Shin during his time at Samsung. These collaborations have fostered a creative environment that promotes the advancement of technology in the field of electronics.

Conclusion

Se Meyung Hwang's contributions to the field of printed circuit board technology illustrate the importance of innovation in meeting the demands of contemporary electronic devices. His method for manufacturing build-up multi-layer printed circuit boards continues to influence the design and production of essential components across various industries, ensuring efficiency and reliability in electronic applications.

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