Se Ill Kim

Title: Se Ill Kim - Innovator in Chip Scale Packaging Technology

Introduction

Se Ill Kim is a notable inventor based in Chungcheongnam-do, South Korea. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative methods for manufacturing chip scale packages.

Latest Patents

One of his key patents is titled "Method for manufacturing a chip scale package having slits formed on a substrate." This invention addresses the challenges associated with traditional chip scale packaging by introducing a flexible substrate with a conductive pattern. The method involves forming a first photosensitive resin pattern over the substrate, curing it, and then applying a second photosensitive resin pattern that includes slits. This innovative approach effectively mitigates issues such as the burning of neighboring patterns and the overflow of encapsulants, enhancing the reliability of semiconductor devices.

Career Highlights

Se Ill Kim is currently employed at Samsung Electronics Co., Ltd., a leading global technology company. His work at Samsung has allowed him to be at the forefront of advancements in semiconductor technology, contributing to the company's reputation for innovation and quality.

Collaborations

Throughout his career, Se Ill Kim has collaborated with talented colleagues, including Shin Hyoung Kim and Hee-Guk Choi. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies in the semiconductor industry.

Conclusion

Se Ill Kim's contributions to chip scale packaging technology exemplify the spirit of innovation in the semiconductor field. His patented methods not only solve existing problems but also pave the way for future advancements in the industry.