Company Filing History:
Years Active: 2007
Title: Se-chuel Park: Innovator in Semiconductor Packaging
Introduction
Se-chuel Park is a notable inventor based in Changwon-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 3 patents. His work focuses on enhancing the performance and reliability of lead frames used in semiconductor devices.
Latest Patents
One of his latest patents is for a lead frame designed for semiconductor packages. This innovation addresses critical issues such as high molding resin adhesiveness and low delamination problems in moisture-rich environments. The lead frame features a base metal layer and multiple plating layers, including a Ni plating layer, a Pd plating layer, and a protective Au plating layer. This structure ensures high interface adhesiveness and solder wettability of an Au wire.
Another patent involves a lead frame that can effectively discharge hydrogen adsorbed during deposition. This invention aims to reduce the galvanic potential difference between plating layers. The manufacturing method includes forming a Ni plating layer on a base metal layer, followed by a Pd plating layer, heat treatment, and the application of a protective plating layer.
Career Highlights
Se-chuel Park is currently employed at Samsung Techwin Co., Ltd., where he continues to innovate in semiconductor technology. His expertise in lead frame design has positioned him as a key player in the industry.
Collaborations
He has collaborated with notable coworkers, including Sang-hun Lee and Sung-kwan Paek, contributing to advancements in semiconductor packaging technologies.
Conclusion
Se-chuel Park's contributions to semiconductor packaging through his innovative patents demonstrate his commitment to enhancing technology in this critical field. His work continues to influence the industry positively.