Scott H Estes

Title: Scott H Estes: Innovator in Circuit Board Technology

Introduction

Scott H Estes is a prominent inventor based in Austin, TX, known for his contributions to circuit board technology. He holds a total of five patents, showcasing his innovative approach to solving complex engineering challenges. His work primarily focuses on enhancing the efficiency of integrated circuit (IC) package cooling systems.

Latest Patents

One of Scott's latest patents is for a circuit board-mounted IC package cooling method. This invention involves filling the die cavity in the IC package with a thermally conductive liquid, which significantly improves the transfer of operational die heat toward the inner lid side of the IC package. To effectively dissipate the heat, a series of metal-plated through holes are formed in the circuit board, which are thermally coupled to the IC package die cavity lid. This design allows for efficient heat conduction to the ground plane structure within the circuit board. In another embodiment, the assembly includes a heat sink structure that passes through a circuit board opening, further enhancing thermal management.

Career Highlights

Scott H Estes is currently employed at Dell USA L.P., where he continues to innovate and develop advanced technologies. His work at Dell has positioned him as a key player in the field of electronic cooling solutions, contributing to the company's reputation for high-performance computing products.

Collaborations

Throughout his career, Scott has collaborated with notable colleagues, including Deepak N Swamy and James S Bell. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Scott H Estes is a significant figure in the realm of circuit board technology, with a focus on improving IC package cooling systems. His innovative patents and contributions to Dell USA L.P. highlight his commitment to advancing electronic engineering.