Company Filing History:
Years Active: 1994
Title: Scott E Derosier: Innovator in Multichip Module Substrate Technology
Introduction
Scott E Derosier is a notable inventor based in Rogers, Connecticut, recognized for his contributions to the field of multichip module substrates. With a focus on innovative manufacturing processes, Derosier has developed a unique method that enhances the reliability and efficiency of electronic components.
Latest Patents
Scott E Derosier holds a patent for a "Method of manufacture multichip module substrate." This invention involves an additive process that utilizes multiple layers of a fluoropolymer composite material and copper. The process includes plated copper layers and laminated fluoropolymer composite layers, promoting reliable bonding through a seeding process. The design eliminates the need for a barrier metal layer, allowing for multiple metal and dielectric layers within a single structure. The MCM substrate device features solid copper vias for electrical interconnection and thermal management, showcasing a significant advancement in substrate technology.
Career Highlights
Derosier's career is marked by his work at Rogers Corporation, where he has played a pivotal role in developing cutting-edge technologies. His innovative approach to manufacturing multichip module substrates has positioned him as a leader in the field. With a patent count of 1 patent, his contributions continue to influence the industry.
Collaborations
Throughout his career, Scott E Derosier has collaborated with esteemed colleagues, including W David Smith and John A Olenick. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.
Conclusion
Scott E Derosier's work in multichip module substrate technology exemplifies the spirit of innovation. His patented methods and collaborative efforts contribute significantly to advancements in electronic manufacturing.