Company Filing History:
Years Active: 2001-2009
Title: Scott Allen Bergman: Innovator in Circuit Board Technology
Introduction
Scott Allen Bergman is a notable inventor based in Groveport, OH (US). He has made significant contributions to the field of circuit board technology, holding a total of 2 patents. His innovative designs have enhanced the functionality and efficiency of electronic components.
Latest Patents
One of Bergman's latest patents is for a "Bottom entry interconnection element for connecting components to a circuit board." This invention features an interconnection element designed to couple a component with a circuit board, allowing for effective surface mounting. The design includes a planar portion that aligns with an opening in the circuit board, along with opposing spring fingers that secure component leads from the bottom side of the board.
Another significant patent is the "Apparatus and method for solder attachment of high powered transistors to base heatsink." This invention involves a printed wiring board assembly that utilizes an insert with standoffs to facilitate the soldering of devices with tinned leads. The assembly is heated in a soldering oven, ensuring a reliable connection between the device casing and the printed wiring board.
Career Highlights
Throughout his career, Scott Allen Bergman has worked with several prominent companies, including CommScope, Inc. and Agere Systems Guardian Corporation. His experience in these organizations has contributed to his expertise in circuit board technology and innovation.
Collaborations
Bergman has collaborated with talented individuals in the field, including Sanjay Sudhaker Upasani and Sebsibe Kebede. These partnerships have likely fostered a creative environment that encourages the development of groundbreaking technologies.
Conclusion
Scott Allen Bergman is a distinguished inventor whose work in circuit board technology has led to valuable patents and advancements in the industry. His contributions continue to influence the design and functionality of electronic components.