Company Filing History:
Years Active: 1996
Title: Scott A Versprille: Innovator in Multi-Layer Printed Circuit Board Design
Introduction
Scott A Versprille is a notable inventor based in Vestal, NY (US). He has made significant contributions to the field of printed circuit board design, holding 2 patents that showcase his innovative approach to technology.
Latest Patents
One of his latest patents is a method and apparatus for the cross-sectional design of multi-layer printed circuit boards. This invention discloses a design tool and a method for fabricating multi-layer printed circuit boards. The method utilizes a knowledge base that includes printed circuit board cross-sectional geometric parameters and transmission line parameter data. It also incorporates 'IF . . . THEN . . . ' production rules for various aspects such as lamination, registration, circuitization, testability, and test procedures. The process begins with the user entering design and performance parameters into an interface. Subsequently, the production rules are applied to generate cross-section designs that meet the specified parameters, leading to the construction of the printed circuit board.
Career Highlights
Scott A Versprille is associated with International Business Machines Corporation (IBM), where he has been able to apply his expertise in printed circuit board technology. His work has contributed to advancements in manufacturability, cost efficiency, and test development in the field.
Collaborations
He has collaborated with notable coworkers such as Chi Shih Chang and Subahu Dhirubhai Desai, further enhancing the innovative environment at IBM.
Conclusion
Scott A Versprille's contributions to the field of printed circuit board design exemplify his innovative spirit and dedication to advancing technology. His patents reflect a commitment to improving manufacturability and performance in electronic design.