Company Filing History:
Years Active: 2002
Title: Satoshi Murakawa: Innovator in Multilayer Printed Wiring Board Technology
Introduction
Satoshi Murakawa is a notable inventor based in Hadano, Japan. He has made significant contributions to the field of electronic equipment through his innovative designs and patents. His work primarily focuses on improving the performance and reliability of multilayer printed wiring boards.
Latest Patents
Murakawa holds a patent for a multilayer printed wiring board and electronic equipment. This invention addresses the issue of warping deformation caused by temperature changes in multilayer printed wiring boards. The thermal expansion coefficient of a composite insulator layer is adjusted to suppress this warping. The design features asymmetric thicknesses and covering ratios on both sides of the electric conductor layer, which enhances the board's stability and performance.
Career Highlights
Satoshi Murakawa is associated with Hitachi, Ltd., a leading company in technology and electronics. His work at Hitachi has allowed him to collaborate with other talented professionals in the field. His innovative approach has led to advancements in electronic equipment design, making significant impacts on the industry.
Collaborations
One of Murakawa's notable collaborators is Shigeo Amagi. Together, they have worked on various projects that aim to enhance the functionality and efficiency of electronic devices.
Conclusion
Satoshi Murakawa's contributions to multilayer printed wiring board technology exemplify his innovative spirit and dedication to improving electronic equipment. His patent reflects a deep understanding of material properties and engineering principles, showcasing his role as a key inventor in the field.