Hitachinaka, Japan

Satoshi Hirakawa


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:

goldMedal1 out of 832,912 
Other
 patents

Years Active: 2002

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1 patent (USPTO):Explore Patents

Title: Satoshi Hirakawa: Innovator in Resin Sealed Electronic Devices

Introduction

Satoshi Hirakawa is a notable inventor based in Hitachinaka, Japan. He has made significant contributions to the field of electronic devices, particularly in improving their durability and lifetime. His innovative approach focuses on reducing thermal stresses in resin sealed electronic devices.

Latest Patents

Hirakawa holds a patent for a resin sealed electronic device. This invention enhances the durability and lifetime of such devices by minimizing thermal stresses acting on the power element and the components mounted on the board. The patent describes a power element with a protective film coated in polyimide group resin during manufacturing. Additionally, it utilizes a metallic heat sink with an unplated reverse side surface for mounting on the board. The molding resin's linear expansion coefficient is maintained within a range of 3×10 /°C to 17×10 /°C, effectively balancing the thermal expansion of the parts and improving the overall performance of the device.

Career Highlights

Hirakawa's career is marked by his dedication to advancing electronic device technology. His innovative solutions have garnered attention in the industry, showcasing his expertise in materials and thermal management.

Collaborations

Hirakawa has worked alongside talented colleagues, including Toshiaki Kaminaga and Ryoichi Kobayashi. Their collaborative efforts have contributed to the development of cutting-edge technologies in the field.

Conclusion

Satoshi Hirakawa's work in resin sealed electronic devices exemplifies the impact of innovation on technology. His patent reflects a commitment to enhancing device performance and reliability. His contributions continue to influence the industry and inspire future advancements.

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