Scotch Plains, NJ, United States of America

Satish S Tamhaukar


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 1993

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1 patent (USPTO):Explore Patents

Title: Innovations of Satish S Tamhaukar

Introduction

Satish S Tamhaukar is a notable inventor based in Scotch Plains, NJ (US). He has made significant contributions to the field of circuit design, particularly through his innovative methods for forming copper circuit patterns on ceramic substrates. His work has implications for various applications in electronics and materials science.

Latest Patents

One of Tamhaukar's key patents is titled "Method of forming a copper circuit pattern." This patent describes a method for applying first and second layers of copper oxide and copper to a ceramic substrate. The process involves masking selected regions of the copper to create a specific configuration of the copper circuit pattern. The unmasked regions are then plated using a neutral pH solution through a reverse pulse plating process. After the masking is removed, the copper and copper oxide layers are etched, allowing for the direct bonding of the remaining copper to the substrate.

Career Highlights

Satish S Tamhaukar is associated with The Boc Group, Inc., where he has been able to apply his expertise in circuit design and materials engineering. His innovative approach has led to advancements in the manufacturing processes of electronic components.

Collaborations

Throughout his career, Tamhaukar has worked alongside talented professionals such as Edward K Chang and Richard C Paciej. These collaborations have fostered an environment of innovation and creativity, contributing to the success of their projects.

Conclusion

Satish S Tamhaukar's contributions to the field of circuit design through his patented methods demonstrate his commitment to innovation. His work continues to influence the development of electronic components, showcasing the importance of creativity in engineering.

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