Company Filing History:
Years Active: 1998
Title: Innovations by Sarvotham M Bhandarkar in IC Packaging
Introduction
Sarvotham M Bhandarkar is a notable inventor based in Singapore, recognized for his contributions to the field of integrated circuit (IC) packaging. His innovative designs aim to enhance the performance and reliability of electronic components.
Latest Patents
Bhandarkar holds a patent for an "IC packaging lead frame for reducing chip stress and deformation." This invention focuses on a lead frame design that minimizes chip stress and deformation while improving mold filling. The design features a split die-pad divided into several sections, connected by flexible expansion joints. This configuration allows for relative motion between the pad and the chip during the die attach cure process. By breaking down the total die pad area into smaller sections, the invention effectively reduces the coefficient-of-thermal expansion (CTE) mismatch and out-of-plane deformation, leading to lower chip stress and improved package moldability.
Career Highlights
Bhandarkar is affiliated with the National University of Singapore, where he contributes to research and development in the field of electronics. His work has significantly impacted the design and manufacturing processes of IC packaging, making him a valuable asset in the industry.
Collaborations
One of his notable collaborators is Thiam Beng Lim, with whom he has worked on various projects related to IC packaging and electronic component design.
Conclusion
Sarvotham M Bhandarkar's innovative approach to IC packaging has led to significant advancements in reducing chip stress and improving moldability. His contributions continue to influence the electronics industry positively.