Sang-Mao Chiu

Title: Sang-Mao Chiu: Innovator in Wire-Bonding Technology

Introduction

Sang-Mao Chiu is a notable inventor based in Da-Lin, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in wire-bonding methods for chips with copper interconnects. His innovative approach addresses critical challenges in the bonding process, enhancing the reliability and efficiency of semiconductor devices.

Latest Patents

Sang-Mao Chiu holds a patent for a wire-bonding method for chips with copper interconnects. This method introduces a thin layer to solve the problem of oxidizing a copper bonding-pad during the bonding process. The patent outlines a process that includes providing a chip with a copper bonding-pad, using an aqueous solution to form a Cuprous oxide thin layer on the bonding-pad, and applying ultrasonic power to remove the oxide layer, ensuring strong interconnect bonding.

Career Highlights

Chiu is affiliated with National Chung Cheng University, where he contributes to research and development in semiconductor technologies. His work has been instrumental in advancing the understanding and application of wire-bonding techniques in the industry.

Collaborations

Chiu collaborates with Yeau-Ren Jeng, a fellow researcher, to further explore innovations in semiconductor bonding methods. Their partnership enhances the research output and fosters advancements in the field.

Conclusion

Sang-Mao Chiu's contributions to wire-bonding technology exemplify the importance of innovation in semiconductor manufacturing. His patented methods not only improve bonding strength but also increase yield rates, showcasing his impact on the industry.