Sang-kyu Bang

Title: Sang-kyu Bang: Innovator in Through-Silicon Via Technology

Introduction

Sang-kyu Bang is a notable inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of semiconductor technology, particularly in the area of through-silicon vias (TSVs). His innovative methods have the potential to enhance the performance and efficiency of electronic devices.

Latest Patents

Sang-kyu Bang holds a patent for a method of forming through-silicon vias using laser ablation. This method involves laser drilling to create a series of grooves on the upper surface of a silicon wafer. Following this, the lower surface of the silicon wafer is ground to expose the grooves, resulting in the formation of multiple through-silicon vias. This innovative approach is detailed in his patent titled "Methods of forming through-silicon vias by using laser ablation." He has 1 patent to his name.

Career Highlights

Sang-kyu Bang is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to be at the forefront of technological advancements in semiconductor manufacturing. His expertise in laser ablation techniques has positioned him as a key player in the development of next-generation electronic components.

Collaborations

Some of his notable coworkers include Eui-seok Kim and Soo-hyun Cho. Their collaborative efforts contribute to the innovative environment at Samsung Electronics, fostering advancements in semiconductor technologies.

Conclusion

Sang-kyu Bang's contributions to the field of semiconductor technology, particularly through his patented methods for forming through-silicon vias, highlight his role as an influential inventor. His work continues to impact the electronics industry positively.