Company Filing History:
Years Active: 2021
Title: The Innovative Work of Sang Hyuk Lim in Semiconductor Packaging
Introduction
Sang Hyuk Lim is a prominent inventor based in Icheon-si, South Korea. He has made significant contributions to the field of semiconductor packaging with his innovative designs. With one patent to his name, Lim showcases his ability to advance technology through his inventive solutions.
Latest Patents
Lim's notable patent revolves around semiconductor packages that include a bridge die. His invention describes a semiconductor package comprising first and second semiconductor dies, two redistributed line structures, a first bridge die, and a vertical connector. The design strategically positions the first semiconductor die and the first bridge die on the first redistributed line structure, ensuring a level difference in height for enhanced functionality. This unique configuration aims to improve the overall performance and efficiency of semiconductor packages.
Career Highlights
Sang Hyuk Lim is associated with SK Hynix Inc., a leading semiconductor company known for its advanced memory solutions. Working at SK Hynix has provided Lim with the platform to innovate and develop cutting-edge technologies in semiconductor packaging. His position allows him to leverage the company's resources to contribute to the evolving landscape of semiconductor technology.
Collaborations
During his career, Lim has collaborated with talented professionals in the field, including his esteemed coworker, Ki Jun Sung. These collaborations have played a crucial role in pushing the boundaries of semiconductor innovations, fostering a culture of teamwork and creativity within the industry.
Conclusion
Sang Hyuk Lim's contributions to semiconductor packaging reflect his dedication to innovation and excellence. His patent not only signifies his ingenuity but also highlights the importance of continuous development in semiconductor technology. As Lim continues his journey at SK Hynix Inc., it will be interesting to see how his future innovations will shape the industry.