Sang Hoon Jung

Title: Innovator Sang Hoon Jung: Revolutionizing Die Bonding Technology

Introduction: Sang Hoon Jung is a noteworthy inventor based in Chungcheongnam-do, South Korea. With a keen interest in semiconductor technology, he has made significant contributions to the field through his innovative designs and engineering solutions.

Latest Patents: One of his notable inventions is a patent titled "Die Pickup Module and Die Bonding Apparatus Including the Same." This invention provides a die pickup module, which features a wafer stage to support a wafer containing dies on a dicing tape. The design includes a die ejector situated beneath the dicing tape for the separation of a die intended for pickup. Furthermore, it incorporates a non-contact picker, ensuring that the die is picked up without coming into contact with its surface. An additional vertical driving unit facilitates the vertical movement of the non-contact picker, while an inverting driving unit enables the inversion of the die that was picked up.

Career Highlights: Sang Hoon Jung has contributed to prominent companies, including Semes Co., Ltd. and Samsung Electronics Co., Ltd. Through his roles in these organizations, he has been instrumental in advancing technology in semiconductor manufacturing and automation processes.

Collaborations: His collaborations with industry leaders have further strengthened his position as a significant inventor. The synergy between his innovative ideas and the resources of these companies has led to remarkable advancements in the technology of die bonding apparatuses.

Conclusion: In summary, Sang Hoon Jung stands out as a prolific inventor who is committed to enhancing the efficiency and effectiveness of die bonding technologies. His patent demonstrates his innovative spirit and technical proficiency, making him a valuable asset to the field of semiconductor technology.