Kokomo, IN, United States of America

Samuel R Wennberg


Average Co-Inventor Count = 5.0

ph-index = 2

Forward Citations = 13(Granted Patents)


Company Filing History:


Years Active: 1998

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2 patents (USPTO):Explore Patents

Title: Innovations of Samuel R. Wennberg

Introduction

Samuel R. Wennberg is a notable inventor based in Kokomo, IN (US). He has made significant contributions to the field of electronic circuit assembly through his innovative patents. With a total of 2 patents, his work focuses on enhancing the reliability and performance of solder joints in electronic devices.

Latest Patents

Samuel's latest patents include a method and encapsulation material for processing electronic circuit assemblies. One of his key inventions is the "Solder Joint Encapsulation Material," which provides a method for encapsulating soldered lead joints to enhance their fatigue life. This encapsulation material is a reactive hot melt epoxy that cures at significantly lower temperatures than previous epoxy-based materials. This innovation greatly facilitates the processing of circuit assemblies while ensuring the benefits of encapsulated solder joints. Additionally, the encapsulation material includes a latent curative and filler material to reduce the coefficient of thermal expansion.

Another significant patent is the "Hot Melt Epoxy Encapsulation Material," which shares similar features and benefits as the solder joint encapsulation material. This invention also focuses on improving the fatigue life of solder joints in electronic circuit assemblies, showcasing Samuel's dedication to advancing technology in this area.

Career Highlights

Samuel R. Wennberg has had a distinguished career, working with prominent companies such as Delco Electronics Corporation and Hughes Electronics Corporation. His experience in these organizations has allowed him to develop and refine his innovative ideas, contributing to the advancement of electronic circuit technology.

Collaborations

Throughout his career, Samuel has collaborated with talented individuals, including Ralph D. Hermansen and Theresa Renee Lindley. These collaborations have played a crucial role in the development of his patents and innovations.

Conclusion

Samuel R. Wennberg's contributions to the field of electronic circuit assembly through his innovative patents demonstrate his expertise and commitment to enhancing technology. His work continues to influence the industry, ensuring improved reliability and performance in electronic devices.

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