Company Filing History:
Years Active: 2000
Title: Innovations by Samuel Fu in Electronics Packaging
Introduction
Samuel Fu is an accomplished inventor based in Del Mar, CA (US). He has made significant contributions to the field of electronics packaging through his innovative methods. With a focus on enhancing the functionality and efficiency of conductive core materials, Fu's work has garnered attention in the industry.
Latest Patents
Samuel Fu holds 1 patent for his invention titled "Methods to produce insulated conductive through-features in core." This patent discloses methods for the production of insulated, conductive through-features in conductive core materials specifically designed for electronics packaging. The invention employs protective mask technology to facilitate the selective removal of material from planar conductive core material that has been encapsulated in electrically insulated materials. By filling the cavity in the conductive core material with an electrically insulated material, the through-feature is electrically isolated from the remainder of the core material. This innovative approach creates a conductive through-feature that completely transverses the core of the substrate board. Additionally, the invention provides planar substrates for multilayer printed circuit boards or chip carriers, which comprise the conductive through-features produced by these methods.
Career Highlights
Samuel Fu is currently associated with Ormet Corporation, where he continues to develop and refine his innovative techniques. His work has positioned him as a key player in the advancement of electronics packaging technologies.
Collaborations
Fu has collaborated with notable colleagues, including Pradeep R Gandhi and Gary E Legerton, contributing to a dynamic and innovative work environment.
Conclusion
Samuel Fu's contributions to the field of electronics packaging through his patented methods demonstrate his commitment to innovation and excellence. His work not only enhances the functionality of electronic devices but also paves the way for future advancements in the industry.