Company Filing History:
Years Active: 1997-1998
Title: Innovations by Sammy L Mok
Introduction
Sammy L Mok is a notable inventor based in Cupertino, CA. He has made significant contributions to the field of electronic components, particularly in the area of multiple chip module assemblies. With a total of 3 patents to his name, Mok's work has advanced the technology used in modern computing systems.
Latest Patents
Mok's latest patents include innovative designs for electronic component assemblies. One of his patents describes a "Multiple chip module assembly for top of mother board." This assembly features heat spreaders on both sides and is designed to mount electronic components on a mother board. The multiple chip integrated circuit module consists of a first substrate, such as aluminum, with a multi-layer interconnect structure. Integrated circuits are mounted on this interconnect structure, while a second substrate surrounds the first, incorporating an interconnect structure and an array of circuit contacts. Conductors connect the interconnect structures of both substrates, ensuring efficient thermal management through a thermally conductive baseplate and heat sinks.
Another patent focuses on a "Mounting assembly for multiple chip module with more than one substrate." This design includes a board with an array of board contacts and a circuit module that features an array of circuit contacts. An interposer facilitates electrical connections between the circuit module and the board. The assembly is designed for easy insertion and removal of the circuit module, enhancing the flexibility of computer systems.
Career Highlights
Sammy L Mok is currently associated with Micromodule Systems, Inc., where he continues to innovate in the field of electronic components. His work has been instrumental in developing advanced technologies that improve the performance and efficiency of computing systems.
Conclusion
Sammy L Mok's contributions to the field of electronics through his patents and work at Micromodule Systems, Inc. highlight his role as a key innovator in the industry. His inventions are paving the way for future advancements in electronic component design.