Company Filing History:
Years Active: 2023-2024
Title: Sameer Bondre: Innovator in 3D Routing Technologies
Introduction
Sameer Bondre is a notable inventor based in Pune, India. He has made significant contributions to the field of 3D routing technologies, particularly in the area of CAD modeling. With a total of 3 patents to his name, Bondre's work has advanced the way 3D components are represented and manipulated in two-dimensional spaces.
Latest Patents
One of Bondre's latest patents is titled "Method for maintaining 3D orientation of route segments and components in route harness flattening." This innovative method allows a 3D modeled CAD object to be flattened into a 2D representation while preserving the integrity of user-selected wiring components. The process involves calculating tangents at junction points and applying transformation matrices to ensure accurate alignment between 2D and 3D representations.
Another significant patent is the "Method for backshell components in 3D routing harness and flattening route harness." This invention focuses on flattening a 3D backshell component while maintaining a connected wiring component in 3D. It involves storing sketch segments for curved 3D backshells and calculating flattened routes for segments unconnected to the backshell, ensuring that all components are accurately represented.
Career Highlights
Sameer Bondre is currently employed at Dassault Systèmes SolidWorks Corporation, where he continues to innovate in the field of 3D design and modeling. His work has been instrumental in enhancing the capabilities of CAD software, making it easier for engineers and designers to visualize complex components.
Collaborations
Throughout his career, Bondre has collaborated with talented individuals such as Satyajeet Patil and Nitin Shirkey. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies in 3D routing.
Conclusion
Sameer Bondre's contributions to 3D routing technologies have made a lasting impact on the field of CAD modeling. His innovative patents and collaborative efforts continue to push the boundaries of what is possible in 3D design.