Company Filing History:
Years Active: 2000-2007
Title: Salme Jussila: Innovator in Conductive Polymer Technologies
Introduction
Salme Jussila is a prominent inventor based in Espoo, Finland. She has made significant contributions to the field of conductive polymers, with a focus on layered structures and electromagnetic shielding technologies. With a total of 2 patents, her work has implications for various electronic applications.
Latest Patents
Salme Jussila's latest patents include a layered structure, sensor, and method of producing and using the same. This invention involves a layered structure comprising at least two material layers, formed of a conductive polymer on a substrate material layer. The design allows for a reaction in the conductive polymer when exposed to surrounding conditions. Additionally, the method for producing this layered structure can involve various techniques such as printing, spraying, stamping, casting, spin coating, or photolithographic methods. Another notable patent is a method and arrangement for electromagnetically shielding electronic devices. This invention aims to protect electronic means from external electromagnetic interference while preventing them from interfering with nearby devices. The shielding film consists of one or more conductive polymer films and insulating films, which can be attached to the electronic means through heat or vacuum treatment.
Career Highlights
Throughout her career, Salme Jussila has worked with notable companies, including Nokia Mobile Phones Limited and Metso Corporation. Her experience in these organizations has allowed her to develop her expertise in innovative technologies and applications.
Collaborations
Salme has collaborated with esteemed colleagues such as Seppo Pienimaa and Tapio Taka, contributing to her success in the field of conductive polymers.
Conclusion
Salme Jussila's innovative work in conductive polymer technologies showcases her significant contributions to the field. Her patents reflect her commitment to advancing electronic applications through novel methods and materials.