Company Filing History:
Years Active: 2010-2019
Title: The Innovative Mind of Saifuddin M Ansari
Introduction
Saifuddin M Ansari is an accomplished inventor based in West Chester, OH, who has made significant contributions to the field of heat transfer technology. With a total of four patents to his name, he has demonstrated a strong commitment to innovation and the advancement of manufacturing processes in labeling.
Latest Patents
Among his latest innovations is the "Heat transfer label assembly," which comprises a label and a carrier designed for releasably supporting the label. Notably, the carrier may be made of paper, and a unique release layer consisting of polymer and wax is situated between the label and the carrier, allowing the carrier to be devoid of a solvent impermeable coating and enabling direct placement of the release layer on the paper. Another notable patent is the "Digitally printed heat transfer label and method of making a decorated article," which outlines a heat transfer label assembly featuring a carrier, a release layer overlying one side of the carrier, and a primer layer made from at least one polyacrylic acid polymer. These patents showcase his innovative approach to enhancing the functionality and efficiency of labeling systems.
Career Highlights
Saifuddin's career has seen him work with notable companies such as Mcc-Norwood, LLC and Graphic Packaging International, Inc. His experience in these organizations has further honed his skills as an inventor, allowing him to develop unique solutions to complex problems.
Collaborations
Throughout his journey, Saifuddin has collaborated with industry professionals like Douglas Barnhardt and Robert J Wojewoda. These collaborations have enabled him to expand his creative horizons and contribute effectively to the field of heat transfer labels.
Conclusion
Saifuddin M Ansari's dedication to innovation is reflected in his impressive patent portfolio and fruitful collaborations. As he continues to forge new paths in the industry, his contributions to heat transfer technology hold great promise for future advancements.