Kawanishi, Japan

Saburoh Kumada


Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 30(Granted Patents)


Company Filing History:


Years Active: 1981

Loading Chart...
1 patent (USPTO):Explore Patents

Title: The Innovations of Saburoh Kumada

Introduction

Saburoh Kumada is a notable inventor based in Kawanishi, Japan. He has made significant contributions to the field of packaging materials, particularly through his innovative patent related to olefin packaging laminates. His work has implications for various industries, enhancing the efficiency and effectiveness of packaging solutions.

Latest Patents

Kumada holds a patent for an olefin packaging laminate, which is a heat sealable packaging material. This invention comprises a stretched base layer formed of a propylene polymer and a stretched surface layer made from a blend of a propylene-ethylene copolymer and a C4-C10 alpha-olefin-propylene copolymer. The weight proportion of these components ranges from 20:80 to 94:6 by weight on at least one surface of the base layer. This innovative approach to packaging materials has the potential to improve product preservation and reduce waste.

Career Highlights

Kumada is associated with Toyo Boseki Kabushiki Kaisha, a company known for its advancements in textile and packaging technologies. His work at the company has allowed him to focus on developing new materials that meet the evolving needs of the market. With a patent count of 1 patent, his contributions are recognized within the industry.

Collaborations

Kumada has collaborated with Tsutomu Isaka, a fellow innovator, to further enhance the development of packaging technologies. Their partnership exemplifies the importance of teamwork in driving innovation and achieving successful outcomes in research and development.

Conclusion

Saburoh Kumada's contributions to the field of packaging materials through his innovative patent demonstrate his commitment to advancing technology. His work not only benefits the industry but also sets a foundation for future innovations in packaging solutions.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…