Las Pinas, Philippines

Ryan Ross Agbay Alinea


Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2023-2025

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2 patents (USPTO):Explore Patents

Title: Ryan Ross Agbay Alinea: Innovator in Electronic Packaging Solutions

Introduction

Ryan Ross Agbay Alinea is a notable inventor based in Las Pinas, Philippines. He has made significant contributions to the field of electronic packaging, holding a total of 2 patents. His innovative approaches have paved the way for advancements in how electronic components are connected and encapsulated.

Latest Patents

Alinea's latest patents include a method of manufacturing a package using a clip with at least one locking recess. This method involves connecting an electronic component with a carrier by a clip that features a locking recess. The encapsulant partially encapsulates the clip, ensuring that part of its main surface remains exposed. The design allows for the locking of the encapsulant and the clip by accommodating the encapsulant's material within the locking recess. Another patent focuses on the clip itself, which is designed to connect an electronic component with a carrier in a package. This clip includes a body with a component connection portion and a carrier connection portion, along with at least one locking recess to secure the encapsulant.

Career Highlights

Ryan Alinea is currently employed at Infineon Technologies AG, where he continues to innovate in the field of electronic packaging. His work has been instrumental in developing efficient methods for connecting electronic components, enhancing the reliability and performance of electronic devices.

Collaborations

Alinea collaborates with talented professionals in his field, including Melvin Levardo and Markus Dinkel. Their combined expertise contributes to the innovative projects at Infineon Technologies AG.

Conclusion

Ryan Ross Agbay Alinea is a prominent inventor whose work in electronic packaging has led to valuable patents and advancements in the industry. His contributions continue to shape the future of electronic component connectivity.

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