Ryan P Moffat

Title: Ryan P Moffat: Innovator in Heat Shield Technology

Introduction

Ryan P Moffat is a notable inventor based in London, Canada. He has made significant contributions to the field of automotive engineering, particularly in the development of heat shield technology. His innovative approach has led to advancements that enhance the performance and acoustical properties of vehicular engine components.

Latest Patents

Moffat holds a patent for a "Heat shield having a fold-over edge crimp with variable width and method of making same." This invention provides an improved heat shield that reduces noise transmission from engine components. The design features three layers: a first sheet layer, a center insulation layer, and a second sheet layer. The insulation layer is strategically positioned between the first and second layers. The first sheet layer has a variable shaped periphery that folds over the second sheet layer, creating a hem with a variable length. This design reduces uneven strain during the crush forming process and alters the resonate frequency in specific areas, thereby minimizing vibration and enhancing acoustical properties.

Career Highlights

Ryan P Moffat is currently employed at Dana Corporation, a leading company in the automotive parts industry. His work at Dana has allowed him to apply his innovative ideas in practical applications, contributing to the company's reputation for quality and performance in automotive components.

Collaborations

Moffat has collaborated with several talented individuals in his field, including Colin C Chen and Frank Walter Popielas. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Ryan P Moffat is a distinguished inventor whose work in heat shield technology has made a significant impact on the automotive industry. His innovative designs and collaborative efforts continue to drive advancements in vehicular engineering.