Company Filing History:
Years Active: 2018-2019
Title: Ryan D Lewis: Innovator in Conductor Assembly Technology
Introduction
Ryan D Lewis is a notable inventor based in Warren, OH (US). He has made significant contributions to the field of conductor assembly technology, holding a total of 4 patents. His innovative designs focus on enhancing the functionality and efficiency of cable assemblies.
Latest Patents
Among his latest patents is a "Conductor assembly with a crimped tubular ferrule and method and tool for manufacturing same." This invention features a cable assembly that includes an elongate conductor surrounded by an outer insulator and an outer ferrule. The outer surface of the ferrule is deformed to create an indentation that forms a barb, which partially penetrates the outer insulator. Another notable patent is also titled "Conductor assembly with a crimped tubular ferrule and method of manufacturing same." This assembly includes a coaxial electrical cable with a cylindrical seamless outer ferrule that is deformed to define four indentations and projections evenly spaced around its circumference.
Career Highlights
Ryan D Lewis has worked with prominent companies in the technology sector, including Delphi Technologies, Inc. and Aptiv Technologies Limited. His experience in these organizations has contributed to his expertise in developing innovative conductor assembly solutions.
Collaborations
Throughout his career, Ryan has collaborated with talented individuals such as Shae T McGarvey and Michael Messuri. These partnerships have fostered a creative environment that has led to the development of his patented technologies.
Conclusion
Ryan D Lewis is a distinguished inventor whose work in conductor assembly technology has resulted in multiple patents. His innovative contributions continue to impact the industry positively.