Company Filing History:
Years Active: 2025
Title: Runji Xie: Innovator in Chip Cooling Technology
Introduction
Runji Xie is a notable inventor based in Zhanjiang, China. He has made significant contributions to the field of chip cooling technology. His innovative approach focuses on enhancing the efficiency of cooling systems through advanced micro-nano structures.
Latest Patents
Runji Xie holds 1 patent for his invention titled "Chip cooling platform based on micro-nano structure." This patent discloses a cooling platform that includes a platform body, a cooling pipeline, and an outer heat dissipation device. The cooling pipeline is designed in a closed-loop structure, with part of it integrated into the platform body. It is filled with a cooling medium, and features a turbulence structure on the inner wall of the pipeline located within the platform body. Additionally, a unidirectional hydraulic pump is installed on the cooling pipeline outside the platform body, while the outer heat dissipation device is responsible for radiating the cooling medium.
Career Highlights
Runji Xie is affiliated with Guangdong Ocean University, where he continues to advance his research and development in innovative cooling technologies. His work is pivotal in addressing the challenges faced in thermal management for electronic devices.
Collaborations
Runji collaborates with esteemed colleagues such as Haowei Li and Weijun Feng, contributing to a dynamic research environment that fosters innovation.
Conclusion
Runji Xie's contributions to chip cooling technology exemplify the importance of innovation in enhancing electronic device performance. His work not only showcases his inventive spirit but also highlights the collaborative efforts within the academic community.