Rudi Hendel

Title: Rudi Hendel: Innovator in Submicron Via Technology

Introduction

Rudi Hendel is a notable inventor based in Summit, NJ (US). He has made significant contributions to the field of semiconductor manufacturing, particularly in the area of submicron vias. His innovative approach has led to advancements that enhance the efficiency and reliability of electronic components.

Latest Patents

Rudi Hendel holds a patent for a method for planarization of submicron vias. This patent describes a process where submicron vias are filled by sputter deposition of a conductor, such as aluminum, onto a substrate like silicon or silicon oxides. The method involves depositing the aluminum film at a lower temperature initially, followed by an increase in temperature. This temperature differential causes the conductor to expand into the via, effectively filling it. The invention is particularly useful for vias with aspect ratios up to 4 and re-entrant angles of up to 20 degrees.

Career Highlights

Throughout his career, Rudi Hendel has focused on developing innovative solutions that address the challenges in semiconductor manufacturing. His work has contributed to the advancement of technologies that are critical for the production of modern electronic devices.

Collaborations

Rudi has collaborated with Hyman J Levinstein, working together to push the boundaries of technology in their field. Their partnership has fostered an environment of innovation and creativity.

Conclusion

Rudi Hendel's contributions to the field of semiconductor technology, particularly through his patent on submicron vias, highlight his role as an influential inventor. His work continues to impact the industry, paving the way for future advancements in electronic manufacturing.