Hsinchu, Taiwan

Ru Lin Yang


Average Co-Inventor Count = 8.0

ph-index = 1

Forward Citations = 9(Granted Patents)


Company Filing History:


Years Active: 2011

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1 patent (USPTO):Explore Patents

Title: The Innovations of Ru Lin Yang

Introduction

Ru Lin Yang is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of integrated circuit (IC) design. His innovative approach has led to the development of a unique patent that addresses challenges in post-silicon IC design changes.

Latest Patents

Ru Lin Yang holds a patent titled "System for implementing post-silicon IC design changes." This patent describes an engineering change order (ECO) that modifies an IC with spare cell instances. The process involves converting active cell instances that implement portions of the IC to be deleted into additional spare cell instances. It also includes creating a technology-independent behavioral model of the portions of the IC to be added. The selection of spare cell instances to implement the behavior model is crucial, as is routing nets to these selected spare cell instances in a manner that minimizes the number of metal layers of the IC that are modified. This innovative solution enhances the efficiency and effectiveness of IC design modifications.

Career Highlights

Ru Lin Yang is currently employed at SpringSoft USA, Inc., where he continues to push the boundaries of IC design technology. His work has been instrumental in advancing the capabilities of integrated circuits, making them more adaptable to changes in design requirements.

Collaborations

Some of Ru Lin Yang's coworkers include Hsin-Po Wang and Yu-Sheng Lu. Their collaborative efforts contribute to the innovative environment at SpringSoft USA, Inc., fostering advancements in IC design.

Conclusion

Ru Lin Yang's contributions to the field of integrated circuit design through his patent and work at SpringSoft USA, Inc. highlight his role as a significant innovator in the industry. His innovative solutions continue to shape the future of IC technology.

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