Location History:
- Summit, NJ (US) (1979)
- Westfield, NJ (US) (1982)
Company Filing History:
Years Active: 1979-1982
Title: The Innovations of Roy C. LeCraw
Introduction
Roy C. LeCraw is a notable inventor based in Summit, NJ (US). He has made significant contributions to the field of materials science, particularly in the development of devices utilizing garnet materials. With a total of 4 patents to his name, LeCraw's work has advanced the understanding and application of magnetic anisotropy in garnet layers.
Latest Patents
LeCraw's latest patents focus on devices that depend on garnet materials. One of his notable inventions involves devices based on epitaxial garnet layers that exhibit a high magnetic anisotropy. These garnet layers are produced by introducing Co²⁺ or a species with 1, 2, 4, or 5 electrons in a 4d or 5d electron orbital in the octahedral site of the garnet. This innovative approach allows for a complementary contribution to magnetic anisotropy from both the dodecahedral and octahedral sites. Another significant patent discloses advantageous garnet-based devices that contribute to magnetic anisotropy beyond the presence of magnetic rare earth ions. These devices can produce epitaxial garnets with low damping constants and high magnetic energy density.
Career Highlights
LeCraw has had a distinguished career at Bell Telephone Laboratories, where he has been instrumental in research and development. His work has not only contributed to the advancement of garnet materials but has also paved the way for new applications in various technologies.
Collaborations
Throughout his career, LeCraw has collaborated with esteemed colleagues such as Stuart L. Blank and Ernst M. Gyorgy. These collaborations have further enriched his research and have led to significant advancements in the field.
Conclusion
Roy C. LeCraw's innovative work in garnet materials and magnetic anisotropy has made a lasting impact on the field of materials science. His contributions continue to influence the development of advanced technologies.