Company Filing History:
Years Active: 1995-2010
Title: The Ingenious Mind of Ronald W Smith
Introduction
Ronald W Smith, a prominent inventor based in Blue Bell, PA, has significantly contributed to the field of electronics through his innovative ideas and patented inventions. With a notable three patents to his name, his work demonstrates a deep understanding of materials and processes essential for modern electronic devices.
Latest Patents
One of Ronald W Smith’s latest patents includes an innovative electronic package formed using low-temperature active solder, incorporating elements such as indium, bismuth, and/or cadmium. This active solder alloy plays a crucial role in bonding electronic devices to substrates, resulting in high-strength joints through an efficient soldering method. The alloy is designed to facilitate low-temperature soldering, which occurs at temperatures below 180°C and within narrow melting ranges of less than 10°C. Furthermore, the process involves meticulously cleaning and preparing workpiece surfaces, followed by mechanical activation of the solder material to ensure solid bonding.
Career Highlights
Throughout his career, Ronald W Smith has worked for notable companies, including Materials Resources International and Ford Motor Company Limited. His experiences in these reputable organizations have likely enriched his technical expertise and fostered a strong foundation for his inventive pursuits.
Collaborations
In the realm of innovation, collaboration often leads to groundbreaking advancements. Ronald has worked alongside esteemed colleagues such as Robert C McCune and Michael R Kim. Their combined expertise and commitment to excellence have likely led to the successful development of his inventive concepts.
Conclusion
In summary, Ronald W Smith's contributions to electronics through his patents on low-temperature active solder highlight the importance of innovation in modern technology. His collaboration with industry professionals further illustrates the collaborative spirit intrinsic to advancements in invention. As technology continues to evolve, inventors like Ronald will play a vital role in shaping the future of electronic packaging and soldering techniques.