Company Filing History:
Years Active: 1991
Title: The Innovations of Ronald B Browne
Introduction
Ronald B Browne is a notable inventor based in Liverpool, NY (US). He has made significant contributions to the field of integrated circuit technology. His work primarily focuses on enhancing the efficiency and functionality of microwave and millimeter wave signals.
Latest Patents
One of Ronald B Browne's key patents is titled "Conductively enclosed hybrid integrated circuit assembly using a silicon." This patent describes a conductively enclosed hybrid integrated circuit assembly designed for use with microwave and millimeter wave signals. The innovative enclosure utilizes a silicon substrate, which is etched to form recesses that support individual MMIC chips. These chips are positioned flush with the unetched substrate surfaces. The assembly is then covered with a thin solid dielectric layer, which is perforated over connection points and followed by metallization to establish point-to-point connections. This arrangement ensures efficiency in signal grounding and RF transmission line paths through surface metallizations and low impedance paths within the substrate. Fully hermetic seals are achieved using conventional silicon processing, and the input/output connections can be either electrical or optical.
Career Highlights
Ronald B Browne has had a distinguished career, working at General Electric Company. His expertise in integrated circuit technology has positioned him as a valuable asset in the field. His innovative approaches have led to advancements that benefit various applications in electronics.
Collaborations
Throughout his career, Ronald has collaborated with notable colleagues, including David A Bates and David P Smith. These collaborations have fostered an environment of innovation and have contributed to the development of cutting-edge technologies.
Conclusion
In summary, Ronald B Browne is a prominent inventor whose work in integrated circuit technology has made a lasting impact. His patent on conductively enclosed hybrid integrated circuit assemblies showcases his innovative spirit and dedication to advancing technology.