Company Filing History:
Years Active: 2006
Title: The Innovations of Ron Tripp
Introduction
Ron Tripp is an accomplished inventor based in Binghamton, NY. He has made significant contributions to the field of electronics through his innovative designs and patents. With a total of 2 patents, Tripp has focused on improving the efficiency and effectiveness of solder printing processes.
Latest Patents
Tripp's latest patents include a "Coated stencil with reduced surface tension" and "Solder printing using a stencil having a reverse-tapered aperture." The first patent describes a stencil used for printing solder paste on a contact pad of a printed wiring board. This stencil features interior surfaces coated with a material, such as parylene, which has a lower surface tension than the uncoated surfaces. The design allows for improved solder paste application through one or more reverse-tapered apertures, enhancing the overall printing process. The second patent also focuses on the reverse-tapered apertures, emphasizing their variable cross-section that facilitates better solder paste entry and application.
Career Highlights
Ron Tripp is currently employed at Fry's Metals, Inc., where he continues to innovate and develop new technologies. His work has been instrumental in advancing solder printing techniques, which are crucial for the manufacturing of printed wiring boards.
Collaborations
Tripp has collaborated with notable coworkers, including Ian McPhee Fleck and Prashant Chouta. Their combined expertise has contributed to the successful development of innovative solutions in the field.
Conclusion
Ron Tripp's contributions to the field of electronics through his patents and work at Fry's Metals, Inc. highlight his commitment to innovation. His advancements in solder printing technology are paving the way for more efficient manufacturing processes.