Rollin G Meyer

Title: Rollin G Meyer: Innovator in Rigid-Flex Printed Circuit Boards

Introduction

Rollin G Meyer is a notable inventor based in Hockley, TX (US). He has made significant contributions to the field of printed circuit boards, particularly in the development of multilayer rigid-flex designs. With a total of 2 patents, Meyer has demonstrated his expertise and innovation in this specialized area.

Latest Patents

Meyer’s latest patents focus on multilayer rigid-flex printed circuit boards designed for use in infrared reflow. These boards feature a rigid section and a flexible section that extends from the rigid part. The design is capable of withstanding the high temperatures encountered in high-volume production environments that utilize infrared reflow ovens. The invention includes spacers and covers that protect the flexible section from extreme heat. Additionally, a process for assembling components and devices on these boards in a high-volume production setting is also disclosed.

Career Highlights

Throughout his career, Rollin G Meyer has worked with prominent companies such as Compaq Computer Corporation and Teledyne Industries. His experience in these organizations has contributed to his development as an inventor and innovator in the technology sector.

Collaborations

Meyer has collaborated with notable coworkers, including Eric R Edwin and James J Tumlinson. These partnerships have likely enriched his work and contributed to the success of his inventions.

Conclusion

Rollin G Meyer is a distinguished inventor whose work in multilayer rigid-flex printed circuit boards has made a significant impact in the industry. His innovative designs and processes continue to influence high-volume production environments.