Rodney H Pare

Title: Innovations of Rodney H. Pare: Heat Sink Assemblies

Introduction

Rodney H. Pare, an inventive mind hailing from West Warwick, Rhode Island, has made significant contributions to the field of thermal management through his innovative heat sink assemblies. With a total of three patents to his name, Pare has demonstrated a commitment to enhancing the performance and efficiency of electronic components.

Latest Patents

One of his notable innovations is the "Heat Sink Assembly with Adjustable Mounting Clip." This invention features a customizable mounting clip that allows for precise adjustments to accommodate integrated circuit device sockets of various lengths. The design includes removable legs of the mounting clip, enabling further adaptation to neighboring circuit board components. By threading a heat sink member into flush thermal communication with the top surface of an integrated circuit device, heat dissipation is effectively achieved.

Another significant patent is the "Heat Sink Assembly with Height Adjustable Mounting Clip." This assembly focuses on versatility, as the legs of the mounting clip can be adjusted to fit different sizes and shapes of heat sink members. The overall height of the clip is customizable by selecting a specific radial flange, which can be mounted to a flange seat on a universal top member. This flexibility allows users to snap off unwanted portions of the legs, creating a tailored, low-profile heat sink assembly.

Career Highlights

Rodney H. Pare has worked with several companies, notably Chip Coolers, Inc. and Square Head Inc. His work in these organizations has furthered the development of practical solutions for managing heat in electronic devices, underscoring his role as an innovator in this critical area of technology.

Collaborations

Throughout his career, Pare has collaborated with notable individuals including William B. Rife and Peter D. Tata. These partnerships have likely contributed to the development and refinement of his innovative ideas, promoting advancements in the design and effectiveness of heat sink technologies.

Conclusion

Rodney H. Pare stands out as a dedicated inventor in the thermal management sector, with his latest patents reflecting his commitment to improving electronic component performance. His innovative heat sink assemblies highlight the importance of adaptability and customization in modern engineering, ensuring that technology continues to evolve efficiently.