Rod A Smith

Title: The Innovations of Rod A Smith

Introduction

Rod A Smith is a notable inventor based in Vestal, NY (US). He has made significant contributions to the field of electrical engineering, particularly in the development of high-density connectors. His innovative designs have paved the way for improved interconnectivity in electronic devices.

Latest Patents

Rod A Smith holds a patent for a high-density connector. This electrical connector is designed for interconnecting a pair of circuit members, such as a circuit board and module. The connector features a housing, at least one flexible circuit within the housing, and a spring mechanism that exerts force against the flexible circuit. This design ensures that the circuit engages with the conductive pads on the circuit members when they are compressed together. The spring's shape conforms to the flexible circuit, enhancing the reliability of the connection. Additionally, the connector includes a compressible contact member that occupies a prestressed position before engagement, moving to a compressed position during the connection process. The conductive components in both embodiments utilize dendrites to provide enhanced connections.

Career Highlights

Rod A Smith is associated with the International Business Machines Corporation (IBM), where he has contributed to various projects and innovations. His work has been instrumental in advancing the technology behind electrical connectors, making them more efficient and reliable.

Collaborations

Some of Rod A Smith's coworkers include Raymond A Busacco and Chi Shih Chang. Their collaborative efforts have furthered the development of innovative technologies within their field.

Conclusion

Rod A Smith's contributions to the field of electrical engineering, particularly through his patent for a high-density connector, demonstrate his commitment to innovation. His work at IBM and collaborations with other professionals highlight the importance of teamwork in advancing technology.