Rancho Santa Margarita, CA, United States of America

Roberto U Villanueva


Average Co-Inventor Count = 2.0

ph-index = 3

Forward Citations = 58(Granted Patents)


Location History:

  • Irvine, CA (US) (2002)
  • Rancho Santa Margarita, CA (US) (2003 - 2004)

Company Filing History:


Years Active: 2002-2004

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3 patents (USPTO):Explore Patents

Title: Innovations of Roberto U Villanueva

Introduction

Roberto U Villanueva is a notable inventor based in Rancho Santa Margarita, California. He has made significant contributions to the field of semiconductor packaging, holding three patents that showcase his innovative approach to technology.

Latest Patents

One of his latest patents is titled "Molded shield structures and method for their fabrication." This invention involves a die attached to a printed circuit board using die attach epoxy. A post is then attached adjacent to the die, which can be made of copper or solder-coated ceramic. A shield is mounted on the post, enclosing an area that includes the die and possibly additional elements. The shield can be constructed from materials such as stainless steel, copper, or a copper alloy, and may even be a wire mesh made of copper or aluminum. After the shield is mounted, a molding compound encapsulates the shield, the post, the die, and any additional elements.

Another significant patent is "Exposed paddle leadframe for semiconductor die packaging." In this invention, a leadframe with at least one tab is placed inside a mold cavity. During the molding process, the ceiling of the mold cavity presses against the tab, ensuring that the bottom surface of the leadframe is firmly pressed against the floor of the mold cavity. This design prevents the mold compound from reaching under the leadframe's bottom surface, enhancing the efficiency of the packaging process.

Career Highlights

Roberto U Villanueva is currently employed at Skyworks Solutions, Inc., where he continues to innovate in the semiconductor industry. His work has significantly impacted the development of advanced packaging solutions.

Collaborations

He has collaborated with notable colleagues such as Siamak Fazelpour and Hassan S Hashemi, contributing to a dynamic work environment that fosters innovation.

Conclusion

Roberto U Villanueva's contributions to semiconductor packaging through his patents demonstrate his expertise and commitment to innovation. His work at Skyworks Solutions, Inc. continues to influence the industry positively.

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