Robert Wise

Title: The Innovative Contributions of Robert Wise

Introduction

Robert Wise is a notable inventor based in Telford, PA (US). He has made significant contributions to the field of technology, particularly in the area of bonding methods for electronic components. With a total of 2 patents to his name, Wise continues to push the boundaries of innovation.

Latest Patents

Wise's latest patents include a groundbreaking method and apparatus for low loop height ball bonding. This invention involves forming a bump on top of a die bond pad by creating a ball bond. Without severing the wire, the capillary undergoes coordinated motions to fold the wire on top of the ball bond. The wire is then bonded on top of the ball bond bump, followed by additional coordinated xy motions to form the loop and position the capillary over the second bond site, such as on the lead frame. Finally, the wire is stitch bonded to the second bond site, and the tail is severed to complete the wire loop interconnect.

Career Highlights

Robert Wise is currently employed at Kulicke and Soffa Industries, Inc., where he applies his expertise in bonding technologies. His work has been instrumental in advancing the efficiency and reliability of electronic component manufacturing.

Collaborations

Wise collaborates with talented individuals in his field, including his coworker Ivy Wei Qin. Their combined efforts contribute to the innovative projects at Kulicke and Soffa Industries, Inc.

Conclusion

Robert Wise's contributions to the field of bonding methods are noteworthy and reflect his commitment to innovation. His patents demonstrate a deep understanding of technology and its applications in electronics. As he continues to develop new methods, Wise remains a key figure in the advancement of electronic manufacturing processes.