Company Filing History:
1 out of 5 
1 out of 832,812 Years Active: 2002
Title: The Innovations of Robert Vinson Burress
Introduction
Robert Vinson Burress is a notable inventor based in San Diego, CA. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on advanced packaging methods that enhance the performance and reliability of electronic devices.
Latest Patents
One of his latest patents is for a semiconductor flip-chip package and method for the fabrication thereof. This innovation involves a flip-chip device that utilizes a multilayer encapsulant. The encapsulant includes a first portion with a coefficient of thermal expansion of at most 30 ppm/° C. and an elastic modulus of 2-20 GPa. Additionally, it features a second portion comprising a polymer flux that may exceed 30 ppm/° C. This dual-layer approach aims to improve the thermal and mechanical properties of semiconductor devices.
Career Highlights
Throughout his career, Robert has worked with various companies, including Miguel Albert Capote. His expertise in semiconductor technology has positioned him as a valuable asset in the industry. His innovative approaches have contributed to advancements in electronic packaging solutions.
Collaborations
Robert has collaborated with notable professionals in his field, including Miguel Albert Capote and Xiaoqi Zhu. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.
Conclusion
Robert Vinson Burress is a distinguished inventor whose work in semiconductor technology has led to significant advancements in the field. His patents reflect a commitment to improving electronic device performance through innovative packaging methods. His contributions continue to influence the industry and inspire future innovations.