Company Filing History:
Years Active: 1997
Title: Innovations of Robert Pfahl
Introduction
Robert Pfahl is an accomplished inventor based in Glen Ellyn, IL (US). He is known for his significant contributions to the field of soldering technology. His innovative methods have paved the way for advancements in electronic manufacturing.
Latest Patents
Robert Pfahl holds a patent for a "Method for forming a solder bump by solder-jetting or the like." This invention provides a method for forming a solder bump on a substrate. The substrate includes a bond pad with a faying surface composed of solder-wettable metal. The method involves coating the faying surface with a plate formed of a first metal with a specific melting temperature. A discrete microdroplet, formed of a molten second metal with a higher melting temperature, is projected onto the plate. The microdroplet fuses to the plate to create the solder bump. He has 1 patent to his name.
Career Highlights
Robert Pfahl has made significant strides in his career, particularly while working at Motorola Corporation. His work has contributed to the development of advanced soldering techniques that are essential in the electronics industry.
Collaborations
Robert has collaborated with various professionals in his field, including his coworker Cynthia M Melton. Their combined expertise has led to innovative solutions in soldering technology.
Conclusion
Robert Pfahl's contributions to soldering technology demonstrate his innovative spirit and dedication to advancing the field. His patent reflects a significant achievement that enhances electronic manufacturing processes.