Robert M Murco

Title: The Innovations of Robert M Murco

Introduction

Robert M Murco is a notable inventor based in Broome County, NY. He has made significant contributions to the field of technology, particularly in the area of chip assembly. His innovative approach has led to the development of a unique patent that enhances the efficiency of electronic devices.

Latest Patents

Murco holds a patent for Direct Chip Attachment (DCA) with electrically conductive adhesives. This patent describes a simple process for card assembly that utilizes electrically conductive adhesives. The process involves two methods that create an intermediate wafer product featuring a layer of insulative thermoplastic and conductive thermoplastic bumps. After sawing or dicing the wafer to form the chips, these chips are adhered to chip carriers with conductive pads that match the conductive thermoplastic bumps, using heat and pressure. This method allows for easy removal and replacement of chips with the application of heat.

Career Highlights

Robert M Murco has had a distinguished career at International Business Machines Corporation, commonly known as IBM. His work has focused on advancing technologies that improve electronic assembly processes. His innovative contributions have positioned him as a key figure in the field.

Collaborations

Throughout his career, Murco has collaborated with talented individuals such as Richard B Booth and Michael A Gaynes. These collaborations have fostered an environment of innovation and creativity, leading to advancements in technology.

Conclusion

Robert M Murco's contributions to the field of technology through his patent for Direct Chip Attachment demonstrate his commitment to innovation. His work at IBM and collaborations with other professionals highlight the importance of teamwork in driving technological advancements.