Robert J Street

Title: The Innovations of Robert J Street

Introduction

Robert J Street is an accomplished inventor based in Manlius, NY (US). He holds a patent for a unique surface mount ceramic package designed for microwave and millimeter wave integrated circuit devices. His innovative approach has contributed significantly to advancements in electronic packaging technology.

Latest Patents

Robert J Street's notable patent is for a surface mount ceramic package. This package features outer conductive pads that allow for direct connection with traces on printed circuit boards. The design includes a metal core with voids or cutouts where the outer pads are located. A first ceramic layer is placed on the core, containing a central cavity for the die, along with a second ceramic layer. Printed traces are strategically buried between these layers, with vias connecting them to the outer pads. Inner pads are positioned on a ledge of the first layer for connection with the die's electrodes. This construction effectively minimizes inductive losses, particularly at higher frequencies.

Career Highlights

Robert J Street is associated with Dover Capital Formation Group, where he applies his expertise in electronic packaging. His work has been instrumental in developing solutions that enhance the performance of integrated circuits.

Collaborations

Robert has collaborated with notable colleagues, including David A Bates and Stephen J Oot. Their combined efforts have fostered innovation and progress in their field.

Conclusion

Robert J Street's contributions to the field of electronic packaging through his patented innovations demonstrate his commitment to advancing technology. His work continues to influence the industry and inspire future developments.