Company Filing History:
Years Active: 1994
Title: Innovations by Robert B Huntington
Introduction
Robert B Huntington is a notable inventor based in Tempe, AZ (US). He has made significant contributions to the field of multichip module substrates. His innovative approach has led to the development of a unique manufacturing process that enhances the reliability and efficiency of electronic components.
Latest Patents
Robert B Huntington holds a patent for a "Method of manufacture multichip module substrate." This invention involves an additive process utilizing multiple layers of a fluoropolymer composite material and copper. The process includes plated copper layers and laminated fluoropolymer composite layers. A seeding process is employed to ensure reliable bonding between the materials. The invention eliminates the need for a barrier metal layer, allowing for multiple metal and dielectric layers within a single structure. The design incorporates lead lines in orthogonal planes and solid copper vias for electrical interconnection and thermal management.
Career Highlights
Huntington is associated with Rogers Corporation, where he has contributed to advancements in electronic manufacturing. His work has focused on improving the performance and manufacturability of multichip modules, which are essential in modern electronics.
Collaborations
Throughout his career, Robert B Huntington has collaborated with notable colleagues, including W David Smith and John A Olenick. These collaborations have furthered the development of innovative technologies in the field.
Conclusion
Robert B Huntington's contributions to the field of multichip module substrates exemplify the impact of innovative thinking in electronics. His patent and work at Rogers Corporation highlight the importance of advancements in manufacturing processes for the future of technology.