Robert A Schetty, Iii

Title: **Innovations by Robert A. Schetty, III**

Introduction

Robert A. Schetty, III is an accomplished inventor based in Fort Salonga, NY, known for his contributions to the field of metallization techniques. With a focus on improving electroplating methods, Schetty has earned two patents that address critical challenges in his area of expertise.

Latest Patents

Schetty's latest inventions include:

1. **Seed Layer Repair Method**: This patent discloses methods for repairing metal seed layers prior to subsequent metallization. The repair methods ensure that metal seed layers disposed on a substrate are substantially free of metal oxide and discontinuities, enhancing the quality of the metallization process.

2. **Electrolytic Copper Plating Method**: This patent provides innovative methods for the use of copper electroplating compositions. Notably, the electroplating compositions include an increased brightener concentration, which is effective for plating difficult-to-plate aperture walls, including high aspect ratio and small diameter microvias.

Career Highlights

Robert A. Schetty, III is associated with Shipley Company, L.L.C., where he continues to innovate in the field of electroplating and metallization. His work not only reflects deep technical knowledge but also a commitment to advancing industry standards.

Collaborations

Throughout his career, Schetty has collaborated with talented professionals such as Leon Barstad and Mark Lefebvre. Their combined expertise allows for a rich exchange of ideas and fosters an environment conducive to innovation.

Conclusion

Robert A. Schetty, III's contributions to the fields of metallization and electroplating are significant. His innovations, particularly in seed layer repair and electrolytic copper plating methods, exemplify the importance of addressing complex challenges within the industry. As he continues to work at Shipley Company, L.L.C., his efforts enrich the technological landscape and pave the way for future advancements.