Company Filing History:
1 out of 832,843 Years Active: 2003
Title: The Innovations of Riyouichi Oota
Introduction
Riyouichi Oota is a notable inventor based in Nanae, Japan. He has made significant contributions to the field of semiconductor technology. His innovative approach has led to the development of a unique semiconductor device that enhances performance and reliability.
Latest Patents
Riyouichi Oota holds a patent for a semiconductor device and method of manufacturing the same. This invention features a tape substrate that supports a semiconductor chip, along with an insulating adhesive layer positioned between the chip and the substrate. The design includes an insulating sheet member that is harder than the adhesive layer, wires for connecting pads on the chip to terminals on the substrate, and a sealing portion that encapsulates the chip in resin. Additionally, the device incorporates multiple solder balls on the back of the substrate. The die bonding layer, which fixes the semiconductor chip, is composed of both the insulating adhesive layer and the laminated insulating sheet member. This multi-layer structure improves the resin balance of the chip's surface and back, preventing warping and enhancing mounting temperature cyclicity and reflow characteristics.
Career Highlights
Throughout his career, Riyouichi Oota has focused on advancing semiconductor technology. His innovative designs have contributed to improved manufacturing processes and device performance. His work has been recognized within the industry for its technical merit and practical applications.
Collaborations
Riyouichi Oota has collaborated with notable colleagues, including Tsugihiko Hirano and Atsushi Fujisawa. These partnerships have fostered a creative environment that encourages the exchange of ideas and expertise in semiconductor development.
Conclusion
Riyouichi Oota's contributions to semiconductor technology exemplify the impact of innovation in the field. His patented designs not only enhance device performance but also pave the way for future advancements in semiconductor manufacturing.