Company Filing History:
Years Active: 1996
Title: Rie Tawata: Innovator in Multilayer Wiring Construction
Introduction: Rie Tawata is a prominent inventor based in Hitachi, Japan. She has made significant contributions to the field of materials science, particularly in the development of multilayer wiring constructions. Her innovative approach has led to advancements in the adhesion properties of polyimide films, which are crucial in various electronic applications.
Latest Patents: Rie Tawata holds 1 patent for her invention titled "Method for forming multilayer wiring construction." This patent addresses the challenges associated with low-thermal-expansivity polyimides, which typically exhibit low adhesion between cured films. Tawata's method involves interposing a flexible polyimide film to enhance adhesion, thereby improving the overall performance of multilayer wiring structures.
Career Highlights: Tawata's career at Hitachi, Ltd. has been marked by her dedication to research and innovation. Her work has not only contributed to the company's technological advancements but has also positioned her as a leader in her field. Tawata's expertise in polyimide materials has been instrumental in developing solutions that meet the demands of modern electronics.
Collaborations: Throughout her career, Rie Tawata has collaborated with esteemed colleagues, including Shunichi Numata and Takao Miwa. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and enhances the quality of research outcomes.
Conclusion: Rie Tawata's contributions to the field of multilayer wiring construction exemplify her innovative spirit and commitment to advancing technology. Her patent on enhancing adhesion in polyimide films is a testament to her expertise and impact in the industry. Tawata continues to inspire future generations of inventors and researchers.