Company Filing History:
Years Active: 2015
Title: Rie Nakahira: Innovator in Pressure-Sensitive Adhesive Technology
Introduction
Rie Nakahira is a prominent inventor based in Osaka, Japan. She has made significant contributions to the field of adhesive technology, particularly with her innovative designs that enhance the functionality of various products. Her work is recognized for its practical applications in the industry.
Latest Patents
Rie Nakahira holds a patent for a pressure-sensitive adhesive sheet and magnetic disk drive. This invention includes a base that consists of a metal layer, a first plastic film layer A, and a second plastic film layer B, along with a pressure-sensitive adhesive layer on the surface of the second plastic film B. The metal layer is strategically positioned between the two plastic film layers, with a thickness ranging from 2 µm to 15 µm. The total thickness of the first and second plastic film layers is maintained within a range of 25 µm to 70 µm, ensuring optimal performance.
Career Highlights
Rie Nakahira is currently employed at Nitto Denko Corporation, a leading company in the adhesive and material technology sector. Her role involves research and development, where she applies her expertise to create innovative solutions that meet market demands.
Collaborations
Throughout her career, Rie has collaborated with notable colleagues, including Kenji Furuta and Yoshihisa Furuta. These partnerships have fostered a creative environment that encourages the exchange of ideas and advancements in technology.
Conclusion
Rie Nakahira's contributions to adhesive technology exemplify her dedication to innovation and excellence. Her patent for a pressure-sensitive adhesive sheet showcases her ability to blend functionality with advanced materials. Rie continues to inspire future generations of inventors in the field.